The sun and the moon are at their best. On February 4, Chizhou Huayu Electronics’ 2022 annual report and 2023 annual work plan arrangement meeting was successfully held. With the theme of “quality oriented and loyal to customers”, the conference comprehensively reviewed and summarized the work in 2022, laid out the development plan in 2023, and signed the letter of responsibility for business objectives and indicators, which unified the idea for the company to further achieve high-quality development. The meeting

People come early in spring, and the year of the rabbit runs forward. Today is the eighth day of the first lunar month, the day of auspiciousness, Chizhou Huayu Electronics 8# plant groundbreaking ceremony was successfully held. The deafening sound of firecrackers, dazzling salutes and cheers on the scene reflect the prosperous, festive and lively start site. Due to product technology upgrades, the company’s 8 factories were decorated and upgraded in November 2021, and the main products are concentrated in

Chizhou Huayu sealing and testing ability Chizhou Huayu Electronics has mass-produced as many as 120 kinds of packaging varieties, more than 30 kinds of finished product test solutions, in 2022, the company will add three-temperature Prober: TSK UF3000EX-e automatic wafer probe station, three-temperature Handler: HT-1028C test sorting machine, 3D Vision inspection appearance inspection machine and S100, 3380, STS8200, NI STS T4, J750HD and other ATE equipment, With automotive-grade product packaging and testing capabilities, we provide our customers with diverse, fast

一元復(fù)始，萬(wàn)象更新，千帆過(guò)盡，向“芯”而行，回首2022，意義非凡，展望2023，充滿希望。 1月9日上午，華宇集團(tuán)2022年經(jīng)營(yíng)分析暨2023年經(jīng)營(yíng)計(jì)劃大會(huì)如期召開。會(huì)議設(shè)池州華宇電子主會(huì)場(chǎng)與深圳寶安、深圳福保、無(wú)錫、合肥四個(gè)分會(huì)場(chǎng)。集團(tuán)董事長(zhǎng)、各子公司負(fù)責(zé)人、高管及員工代表60余人參加了會(huì)議。會(huì)議由集團(tuán)董事長(zhǎng)彭勇主持。 會(huì)上，各子公司負(fù)責(zé)人依次對(duì)2022年的工作經(jīng)營(yíng)以及2023年的發(fā)展方向做了深層次的分析與匯報(bào)，表示未來(lái)我們要更加切實(shí)的服務(wù)好現(xiàn)有客戶，緊跟市場(chǎng)動(dòng)向，向高端市場(chǎng)邁進(jìn)，要在汽車電子芯片上領(lǐng)域開疆?dāng)U土，挖掘更多優(yōu)質(zhì)客戶。 董事長(zhǎng)彭勇就匯報(bào)內(nèi)容做了充分的肯定，并給予高度的認(rèn)可。他表示過(guò)去的一年，是華宇創(chuàng)業(yè)發(fā)展以來(lái)最不平凡的一年。從年初深圳疫情爆發(fā)，到年中無(wú)錫，合肥疫情發(fā)生，再到年底池州疫情，華宇在四個(gè)城市五家工廠疫情靜默管理期間，大家以身作責(zé)，帶領(lǐng)職工駐廠，克服困難，為客戶趕貨，贏得客戶信任。詮釋了天道酬勤，厚德載物。 新的一年，我們要從以下方面抓高質(zhì)量發(fā)展，抓業(yè)績(jī)，抓投資，改善員工福利。 一、 以總經(jīng)理為首的全面質(zhì)量管理體系建設(shè)：利用利用系統(tǒng)和體系管理流程，推動(dòng)企業(yè)高質(zhì)量發(fā)展； 二、內(nèi)控制度要再完善：從五個(gè)工廠全面實(shí)施優(yōu)化企業(yè)經(jīng)營(yíng)管理制度與規(guī)范落實(shí)，讓公司經(jīng)營(yíng)更順，所有工作人員輕裝上陣，責(zé)權(quán)利更清晰。 三、 大力創(chuàng)新與技術(shù)改造：提升芯片測(cè)試領(lǐng)域高端裝備更新，車規(guī)級(jí)芯片成品與晶圓三溫測(cè)試，12英寸大尺寸晶圓測(cè)試能力都需要大幅提升。在封裝方面LGA、QFN、LQFP高腳位，BGA、FCBGA、FANOUT工藝需要積極研發(fā)投入與人才儲(chǔ)備。大力對(duì)現(xiàn)有舊裝備與工藝進(jìn)行技術(shù)改造，確保技術(shù)、品質(zhì)、效率符合當(dāng)前市場(chǎng)競(jìng)爭(zhēng)力。 四、 以質(zhì)為本，忠于客戶：2023年我們需要開拓一批優(yōu)質(zhì)客戶，市場(chǎng)部要圍繞高端封裝系列產(chǎn)品開展揭榜掛帥行動(dòng)，以市場(chǎng)牽頭，觸發(fā)研發(fā)導(dǎo)入，生產(chǎn)規(guī)?；?。 五、 供應(yīng)鏈合作能力提升：維繞SCM管理體系，以QCDS為管理基本法則，重點(diǎn)支持優(yōu)質(zhì)供應(yīng)商，重點(diǎn)建立戰(zhàn)略合作伙伴。 六、 員工福利提升：要始終做好引進(jìn)人才，用好人才，留住人才，成就人才。完善華宇電子人力資源制度，讓公司好口碑口口相傳，每位同事做好對(duì)外形象的第一責(zé)任人。

 12月26日，“中國(guó)集成電路設(shè)計(jì)業(yè)2022年會(huì)暨廈門集成電路產(chǎn)業(yè)創(chuàng)新發(fā)展高峰論壇（ICCAD 2022）”在廈門國(guó)際會(huì)展中心拉開帷幕。   華宇電子立足半導(dǎo)體封測(cè)產(chǎn)業(yè)鏈，用心深耕，形成了具有華宇特色的封測(cè)產(chǎn)業(yè)鏈，展臺(tái)上吸引了眾多客戶及供應(yīng)商駐足探討！ 在ICCAD 12月27日舉辦的先進(jìn)封裝與測(cè)試論壇上，池州華宇電子科技股份有限公司董事長(zhǎng)彭勇以《探索集成電路先進(jìn)封裝發(fā)展新趨勢(shì)》為題做了演講，以先進(jìn)封裝現(xiàn)階段的發(fā)展趨勢(shì)以及華宇電子在先進(jìn)封裝領(lǐng)域取得的成果，華宇電子可為客戶提供一站式、多元化、就近化、一體化的封裝測(cè)試解決方案，為客戶創(chuàng)造價(jià)值。

On November 17, the 2022 World Integrated Circuit Conference, co-hosted by the Ministry of Industry and Information Technology and the People’s Government of Anhui Province, was held in Hefei, Anhui Province. Chizhou Huayu Electronic Technology Co., Ltd. appeared at booth E1-0299. This grand event, with the theme of “win-win cooperation”, released the “2022 World Integrated Circuit Conference “Hefei Initiative”, advocating that the upstream and downstream leading enterprises of the global integrated circuit industry chain jointly maintain the resilience and stability